In this report, the Global Thermo Compression Bonder market is valued at USD XX million in 2019 and is expected to reach USD XX million by the end of 2026, growing at a CAGR of XX% between 2019 and 2026. Global Thermo Compression Bonder market has been broken down by major regions, with complete market estimates on the basis of products/applications on a regional basis.
Thermo Compression Attach. Using this technique, there are no adhesives to join the die and the package. Instead, heat and force are applied to the die in a process called “Thermo Compression Bonding”. The bumps are forced against their opposing pads and a second metallic bond is formed where the bond comes into contact with the package metallization. This technique typically requires the use of heat as high as 350° to 400°C, and forces of as much as 100 g/bump.
Thermo Compression Bonding (TCB) is a chip attach technology under investigation and implementation in multiple platforms. The global Thermo Compression Bonder market is driven by increased Thermo Compression Bonder usage: memory applications currently, logic devices next. Meanwhile, Thermo Compression Bonder is gaining market share from wire bond assembly processes. Also, lower throughput coupled with higher processing costs was example of challenges in the TCB technology.
Market Analysis and Insights: Global Thermo Compression Bonder Market
In 2019, the global Thermo Compression Bonder market size was US$ 49 million and it is expected to reach US$ 189.6 million by the end of 2026, with a CAGR of 21.0% during 2021-2026.
Global Thermo Compression Bonder Scope and Market Size
Thermo Compression Bonder market is segmented by region, by country, company, type, application and by sales channels. Players, stakeholders, and other participants in the global Thermo Compression Bonder market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by region, by country, company, type, application and by sales channels for the period 2015-2026.
Segment by Type, the Thermo Compression Bonder market is segmented into
Automatic Thermo Compression Bonder
Manual Thermo Compression Bonder
Segment by Application, the Thermo Compression Bonder market is segmented into
Regional and Country-level Analysis:
Rest of Asia-Pacific
Rest of Europe
Rest of Latin America
Middle East & Africa
Rest of MEA
Competitive Landscape and Thermo Compression Bonder Market Share Analysis
Thermo Compression Bonder market competitive landscape provides details and data information by companies. The report offers comprehensive analysis and accurate statistics on revenue by the player for the period 2015-2020. It also offers detailed analysis supported by reliable statistics on sale and revenue by players for the period 2015-2020. Details included are company description, major business, Thermo Compression Bonder product introduction, recent developments, Thermo Compression Bonder sales by region, type, application and by sales channel.
The major companies include:
Reasons to Buy This Research Report
- Complete access to Global Thermo Compression Bonder market size, growth rate and forecast to 2026
- In-depth quantitative information on key regional Global Thermo Compression Bonder markets including North America, Europe, MEA and Asia Pacific
- Global Thermo Compression Bonder Market estimates and forecasts for key products/applications on a regional basis
- Facility to obtain country level information for complete Global Thermo Compression Bonder market segmentation
- Key trends, drivers and restraints for global Global Thermo Compression Bonder market
- Challenges to market growth for Global Thermo Compression Bonder manufacturers
- Key market opportunities of Global Thermo Compression Bonder Industry
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